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EMIF06-AUD01F2 Datasheet(PDF) 1 Page - STMicroelectronics |
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EMIF06-AUD01F2 Datasheet(HTML) 1 Page - STMicroelectronics |
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1 / 14 page  February 2008 Rev 1 1/14 EMIF06-AUD01F2 6-line EMI filter and ESD protection for audio interface Features ■ 4-line EMI filter and ESD protection for internal and external (headset) microphone ■ 2-line EMI filter and ESD protection for headset speaker Benefits ■ EMI (I/O) low-pass filter ■ High efficiency EMI filter ■ Very low PCB space consumption: 4.6 mm2 ■ Very thin package: 0.65 mm ■ High efficiency in ESD suppression ■ High reliability offered by monolithic integration ■ High reduction of parasitic elements through integration and wafer level packaging Complies with following standards ■ IEC 61000-4-2 level 4 external pins – 15 kV (air discharge) – 8 kV (contact discharge) ■ IEC 61000-4-2 level 1 internal pins – 2 kV (air discharge) – 2 kV (contact discharge) Applications ESD protection and EMI/RFI filtering for the audio bottom connector interface, where EMI filtering in ESD sensitive equipment is required: ■ Mobile phones and communication systems ■ Wireless modules Description The EMIF06-AUD01F2 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The flip chip packaging means the package size is equal to the die size. This filter includes ESD protection circuitry, which prevents damage to the application when it is subjected to ESD surges up to 15 kV. Figure 1. Pin configuration Flip chip package, 20 bumps MIC1P int GND Int HOOK GND PHG BIAS2 GND MIC1N MIC1P MIC2N MIC2P SPK_R SPK_L BIAS1 MIC1N int BIAS3 MIC2P int MIC2N int SPK_R int SPK_L int Silicon side A B C D 12345 www.st.com |
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