ESDALC6V1-1M2

Package information

5/10

3

Package information

●

Epoxy meets UL94, V0

In order to meet environmental requirements, ST (also) offers these devices in ECOPACK®

packages. ECOPACK® packages are Lead-free. The category of second level Interconnect

is marked on the inner box label, in compliance with JEDEC Standard JESD97. The

maximum ratings related to soldering conditions are also marked on the inner box label.

ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

Note:

Product marking may be rotated by 90° for assembly plant differentiation. In no case should

this product marking be used to orient the component for its placement on a PCB. Only pin 1

mark is to be used for this purpose.

Table 3.

SOD882 dimensions

Ref

Dimensions

Millimetres

Inches

Min

Typ

Max

Min

Typ

Max

A

0.40

0.47

0.50 0.016 0.019 0.020

A1

0.00

0.05 0.000

0.002

b1

0.20

0.25

0.30 0.008 0.010 0.012

b2

0.20

0.25

0.30 0.008 0.010 0.012

D1.00

0.039

E0.60

0.024

e0.65

0.026

L1

0.45

0.50

0.55 0.018 0.020 0.022

L2

0.45

0.50

0.55 0.018 0.020 0.022

(D/2 xE/2)

INDEX AREA

TOP VIEW

(D/2 xE/2)

INDEX AREA

BOTTOM VIEW

SIDE VIEW

D

OPTIONAL PIN#1 ID

b1

b2

e

Figure 12. Footprint (dimensions in mm) Figure 13. Marking

0.55

0.40

0.50

0.55

N

N

Pin1

Pin 2