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SC4612HSTRT Datasheet(PDF) 6 Page - Semtech Corporation |
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SC4612HSTRT Datasheet(HTML) 6 Page - Semtech Corporation |
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6 / 21 page ![]() 6 © 2008 Semtech Corp. www.semtech.com SC4612H POWER MANAGEMENT Pin Descriptions Pin # MLPD Pin# SOIC Pin Name Pin Function 1, 7 NC No connection. 1 2 ILIM The current limit programing resistor at this pin in conjunction with an internal current source programs the current limit threshold for the low side MOSFET R DS-ON sensing. Once the voltage drop across the bottom MOSFET is larger than the programmed value, current limit condition occurs, and the hiccup current limit protection is activated. 2 3 OSC Oscillator Frequency set pin. An external capacitor to GND will program the oscillator frequency. See Table 1 "Frequency vs. C OSC" to determine oscillator frequency. 3 4 SS/EN Soft Start pin. Internal current source connected to a single external capacitor will determine the soft-start duration for the output. Inhibits the chip if pulled down. 4 5 EAO Error Amplifier Output. A compensation network is connected from this pin to FB. 5 8 FB The inverting input of the error amplifier. Feedback pin is used to sense the output voltage via a resistive divider. 6 6 VDD Bias supply. Also, VDD pin is internally used to provide the base drive to the internal pass transistor regulating the DRV supply. 7 9 GND Ground. 8 10 DL Drive Low. Gate drive for bottom MOSFET. 9 11 DRV DRV supplies the external MOSFETs gate drive and the chips internal circuitry. This pin should be bypassed with a ceramic capacitor to GND. DRV is internally regulated from the external supply connected to VDD. If VDD is below 10V, the supply should be directly connected to the DRV pin. 10 12 BST BST signal. Supply for high side driver; can be directly connected to an external supply or to a bootstrap circuit. 11 13 DH Drive High. Gate drive for top MOSFET. 12 14 PHASE The return path for the high side gate drive, also used to sense the voltage at the phase node for adaptive gate drive protection and the low-side R DS-ON current sensing. X N/A THERMAL PAD (GND) Pad for heatsinking purposes. Connect to ground plane using multiple vias. SS SS SS I 2 . 1 X C T ≈ |
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