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LTC2230UP Datasheet(PDF) 12 Page - Linear Technology |
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LTC2230UP Datasheet(HTML) 12 Page - Linear Technology |
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12 / 32 page ![]() LTC2230/LTC2231 12 22301fb (CMOS Mode) AIN+ (Pins 1, 2): Positive Differential Analog Input. AIN– (Pins 3, 4): Negative Differential Analog Input. REFHA (Pins 5, 6): ADC High Reference. Bypass to Pins 7, 8 with 0.1 μF ceramic chip capacitor, to Pins 11, 12 with a 2.2 μF ceramic capacitor and to ground with 1μF ceramic capacitor. REFLB (Pins 7, 8): ADC Low Reference. Bypass to Pins 5, 6 with 0.1 μF ceramic chip capacitor. Do not connect to Pins 11, 12. REFHB (Pins 9, 10): ADC High Reference. Bypass to Pins 11, 12 with 0.1 μF ceramic chip capacitor. Do not connect to Pins 5, 6. REFLA (Pins 11, 12): ADC Low Reference. Bypass to Pins 9, 10 with 0.1 μF ceramic chip capacitor, to Pins 5, 6 with a 2.2 μF ceramic capacitor and to ground with 1μF ceramic capacitor. VDD (Pins 13, 14, 15, 62, 63): 3.3V Supply. Bypass to GND with 0.1 μF ceramic chip capacitors. GND (Pins 16, 61, 64): ADC Power Ground. ENC+ (Pin 17): Encode Input. The input sample starts on the positive edge. ENC– (Pin 18): Encode Complement Input. Conversion starts on the negative edge. Bypass to ground with 0.1 μF ceramic for single-ended ENCODE signal. SHDN (Pin 19): Shutdown Mode Selection Pin. Connect- ing SHDN to GND and OE to GND results in normal operation with the outputs enabled. Connecting SHDN to GND and OE to VDD results in normal operation with the outputs at high impedance. Connecting SHDN to VDD and OE to GND results in nap mode with the outputs at high impedance. Connecting SHDN to VDD and OE to VDD results in sleep mode with the outputs at high impedance. OE (Pin 20): Output Enable Pin. Refer to SHDN pin function. DNC (Pins 21, 22, 40, 43): Do not connect these pins. DB0 - DB9 (Pins 23, 24, 27, 28, 29, 30, 31, 32, 35, 36): Digital Outputs, B bus. At high impedance in full rate CMOS mode. DB9 is MSB. OGND (Pins 25, 33, 41, 50): Output Driver Ground. OVDD (Pins 26, 34, 42, 49): Positive Supply for the Output Drivers. Bypass to ground with 0.1 μF ceramic chip capacitor. OFB (Pin 37): Over/Under Flow Output for B bus. High when an over or under flow has occurred. At high imped- ance in full rate CMOS mode. CLKOUTB (Pin 38): Data Valid Output for B bus. In demux mode with interleaved update, latch B bus data on the falling edge of CLKOUTB. In demux mode with simulta- neous update, latch B bus data on the rising edge of CLKOUTB. This pin does not become high impedance in full rate CMOS mode. CLKOUTA (Pin 39): Data Valid Output for A bus. Latch A bus data on the falling edge of CLKOUTA. DA0 - DA9 (Pins 44 to 48, 51 to 55): Digital Outputs, A bus. DA9 is the MSB. OFA (Pin 56): Over/Under Flow Output for A bus. High when an over or under flow has occurred. LVDS (Pin 57): Output Mode Selection Pin. Connecting LVDS to 0V selects full rate CMOS mode. Connecting LVDS to 1/3VDD selects demux CMOS mode with simulta- neous update. Connecting LVDS to 2/3VDD selects demux CMOS mode with interleaved update. Connecting LVDS to VDD selects LVDS mode. PI FU CTIO S |
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