TMS370CX2XFN datasheet(35/60 Pages) TI

35 / 60 page

TMS370Cx2x

8-BIT MICROCONTROLLER

SPNS018C – FEBRUARY 1993 – REVISED FEBRUARY 1997

POST OFFICE BOX 1443

• HOUSTON, TEXAS 77251–1443

development system support

The TMS370 family development support tools include an assembler, a C compiler, a linker, an in-circuit

emulator XDS/22, CDT, and an EEPROM / UVEPROM programmer.

D Assembler/linker (Part No. TMDS3740850–02 for PC)

–

Includes extensive macro capability

–

Provides high-speed operation

–

Includes format conversion utilities for popular formats

D ANSI C Compiler (Part No. TMDS3740855–02 for PC, Part No. TMDS3740555–09 for HP700™, Sun-3™

or Sun-4

™)

–

Generates assembly code for the TMS370 that can be inspected easily

–

Improves code execution speed and reduces code size with optional optimizer pass

–

Enables direct reference the TMS370’s port registers by using a naming convention

–

Provides flexibility in specifying the storage for data objects

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Interfaces C functions and assembly functions easily

–

Includes assembler and linker

D CDT370 (Compact Development Tool) real-time in-circuit emulation

–

Base (Part Number EDSCDT370 – for PC, requires cable)

–

Cable for 40-pin DIP (Part No. EDSTRG40DILX)

–

Cable for 44-pin PLCC (Part No. EDSTRG44PLCCX)

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Cable for 40-pin SDIP (Part No. EDSTRG40SDILX)

–

EEPROM and EPROM programming support

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Allows inspection and modification of memory locations

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Includes compatibility to upload / download program and data memory

–

Executes programs and software routines

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Includes 1 024 samples trace buffer

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Includes single-step executable instructions

–

Uses software breakpoints to halt program execution at selected address

D XDS/22 in-circuit emulator

–

Base (Part Number TMDS3762210 for PC, requires cable)

–

Cable for 40-pin DIP / SDIP, 44-pin PLCC (Part No. TMDS3788844)

–

Contains all of the features of the CDT370 described previously but does not have the capability to

program the data EEPROM and program EPROM

–

Contains sophisticated breakpoint trace and timing hardware that provides up to 2 047 qualified trace

samples with symbolic disassembly

–

Allows qualification of breakpoints by address and / or data on any type of memory acquisition. Up to four

levels of events can be combined to cause a breakpoint.

HP700 is a trademark of Hewlett-Packard Company.

Sun-3 and Sun-4 are trademarks of Sun Microsystems, Incorporated.

TMS370CX2XFN Datasheet(PDF) 35 Page - Texas Instruments

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