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IKCS12F60B2C Datasheet(PDF) 4 Page - Infineon Technologies AG

Part # IKCS12F60B2C
Description  Control integrated Power System
PDF  18 Pages
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Manufacturer  INFINEON [Infineon Technologies AG]
Direct Link  http://www.infineon.com
Logo INFINEON - Infineon Technologies AG

IKCS12F60B2C Datasheet(HTML) 4 Page - Infineon Technologies AG

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CIPOS™ IKCS12F60B2A
IKCS12F60B2C
Data Sheet
4/18
Rev. 2.2, March 2009
CIPOS™
C
ontrol integrated Power System
Single In-Line Intelligent Power Module
3Φ-bridge 600V / 12A @ 25°C
Features
• Fully isolated Single In-Line molded module
• TrenchStop® IGBTs with lowest VCE(sat)
• Optimal adapted antiparallel diode for low EMI
• Integrated bootstrap diode and capacitor
• Rugged SOI gate driver technology with
stability against transient and negative voltage
• Fully compliant to 3.3V and 5V microcontrollers
• Temperature sense
• Undervoltage lockout at all channels
• Matched propagation delay for all channels
• Low side emitter pins accessible for all phase
current monitoring (open emitter)
• Cross-conduction prevention
• Lead-free terminal plating; RoHS compliant
• Qualified
according
to
JEDEC
1
(high
temperature stress tests for 1000h) for target
applications
Target Applications
• Washing machines
• Consumer Fans and Consumer Compressors
Description
1 J-STD-020 and JESD-022
The CIPOS™ module family offers the chance for
integrating various power and control components
to increase reliability, optimize PCB size and
system costs.
This SIL-IPM is designed to control AC motors in
variable speed drives for applications like air
conditioning,
compressors
and
washing
machines. The package concept is specially
adapted to power applications, which need
extremely good thermal conduction and electrical
isolation, but also EMI-save control and overload
protection. The features of Infineon TrenchStop
®
IGBTs and antiparallel diodes are combined with
a new optimized Infineon SOI gate driver for
excellent electrical performance.
System Configuration
• 3 halfbridges with TrenchStop® IGBT & FW-
diodes
• 3Φ SOI gate driver
• Bootstrap diodes for high side supply
• Integrated 100nF bootstrap capacitance
• Temperature sensor, passive components for
adaptions
• Isolated heatsink
• Creepage distance typ 3.2mm
Certification
UL 1577 (UL file E314539)



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