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S5LS20216BSPGETQ1R Datasheet(PDF) 97 Page - Texas Instruments |
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S5LS20216BSPGETQ1R Datasheet(HTML) 97 Page - Texas Instruments |
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97 / 101 page ![]() TMS570LS20216, TMS570LS20206, TMS570LS10216 TMS570LS10206, TMS570LS10116, TMS570LS10106 www.ti.com SPNS141 – MARCH 2010 8 Mechanical Packaging and Orderable Information The following table(s) show the thermal resistance for the PBGA-ZWT and PQFP-PGE mechanical packages. 8.1 Thermal Data 8.1.1 PGE (S-PQFP-G144) plastic Quad Flat Pack Table 8-1. PGE (S-PQFP-G144) Thermal Resistance Characteristics PARAMETER °C / W RQJA 45 RQJC 5 8.1.2 ZWT (S-PBGA-N337) Plastic ball grid array Table 8-2. ZWT (S-PBGA-N337) Thermal Resistance Characteristics PARAMETER °C / W RQJA TBD RQJC TBD 8.2 Packaging Information The following packaging information and addendum reflect the most current data available for the designated device(s). The data is subject to change without notice and without revision of this document. Copyright © 2010, Texas Instruments Incorporated Mechanical Packaging and Orderable Information 97 Submit Documentation Feedback Product Folder Link(s): TMS570LS20216 TMS570LS20206 TMS570LS10216 TMS570LS10206 TMS570LS10116 TMS570LS10106 |
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