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09HSI-S042-R0-CHT Datasheet(PDF) 18 Page - Hirose Electric |
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09HSI-S042-R0-CHT Datasheet(HTML) 18 Page - Hirose Electric |
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18 / 71 page  Signal Integrity Report – IT3 (17mm) Page 18 Figure 25 Top and side views of via transition with PCB routed on layer 16 Figure 26 SDD for center pair 8 of via transition with routing on layer 16 3.1.3 S parameters (vias + connector + vias) Figure 27 and Figure 32 show the SDD response (i.e., insertion loss, return loss, NEXT, and FEXT) for pair 8 and pair 4 for 100% and 50% pin density configuration of the cascaded vias/connector/vias with PCB routing in the 16th layer for both via transitions. All PCB traces coming out from the vias have been matched to 10.507mm. The results at various frequencies of interest are summarized in Table 5 and Table 6 for 100% and 50% pin density configuration respectively. Figure 28 - Figure 31 and Figure 33 - Figure 36 show the power sum and insertion-to- crosstalk ratio (ICR) profile comparison with the IEEE802.3ap spec of NEXT and FEXT for the different pin density configurations. 3.1.3.1 Fully populated pin assignment |
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