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IP4365CX11/P Datasheet(PDF) 3 Page - NXP Semiconductors

Part # IP4365CX11/P
Description  Integrated (U)SIM card passive filter array and USB full speed ESD protection to IEC 61000-4-2 level 4
PDF  12 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

IP4365CX11/P Datasheet(HTML) 3 Page - NXP Semiconductors

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IP4365CX11_1
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01 — 26 March 2010
3 of 12
NXP Semiconductors
IP4365CX11
Integrated SIM card passive filter array and USB ESD protection
4.
Functional diagram
5.
Limiting values
[1]
Device is qualified with 1000 pulses of
±15 kV contact discharges each, according to the IEC61000-4-2
model and far exceeds the specified level 4 (8 kV contact discharge).
Fig 2.
Schematic diagram
008aaa216
100
Ω
R1
47
Ω
R2
100
Ω
R3
A1
B1
C1
IEC61000-4-2
level 1
protection pins
IEC61000-4-2
level 4
protection pins
A3
B3
C3
A2, C2
D1
D2
D3
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VI
input voltage
−0.5
+5.5
V
VESD
electrostatic discharge
voltage
pins A3, B3, C3, D1, D2 and D3
to ground (A2, C2)
contact discharge
[1]
−15
+15
kV
air discharge
[1]
−15
+15
kV
IEC 61000-4-2 level 4; pins A3,
B3, C3, D1, D2 and D3 to
ground (A2, C2)
contact discharge
−8
+8
kV
air discharge
−15
+15
kV
IEC 61000-4-2 level 1; pins A1,
B1 and C1 to ground (A2, C2)
contact discharge
−2
+2
kV
air discharge
−2
+2
kV
Pch
channel power dissipation continuous power; Tamb = 70 °C
-
60
mW
Ptot
total power dissipation
continuous power; Tamb = 70 °C
-
180
mW
Tstg
storage temperature
−55
+150
°C
Treflow(peak) peak reflow temperature
10 s maximum
-
260
°C
Tamb
ambient temperature
−35
+85
°C



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