IP4365CX11_1

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© NXP B.V. 2010. All rights reserved.

Product data sheet

Rev. 01 — 26 March 2010

7 of 12

NXP Semiconductors

IP4365CX11

Integrated SIM card passive filter array and USB ESD protection

8.

Package outline

Fig 8.

Package outline IP4365CX11 (WLCSP11)

wlcsp11_3x4-b2_po

European

projection

WLCSP11: wafer level chip-size package; 11 bumps (3 x 4 - B2)

detail X

A

X

e

b

e

1

2

3

A

D

C

B

bump A1

index area

D

E

Table 5.

Dimensions for Figure 8

Symbol

Min

Typ

Max

Unit

A

0.57

0.61

0.65

mm

0.18

0.20

0.22

mm

0.39

0.41

0.43

mm

b

0.21

0.26

0.31

mm

D

1.11

1.16

1.21

mm

E

1.51

1.56

1.61

mm

e

-

0.4

-

mm

-

0.8

-

mm

-

1.2

-

mm