PCA9515_9

© NXP B.V. 2009. All rights reserved.

Product data sheet

Rev. 09 — 23 April 2009

13 of 16

NXP Semiconductors

PCA9515

For further information on temperature profiles, refer to Application Note

AN10365

“Surface mount reflow soldering description”.

14. Abbreviations

MSL: Moisture Sensitivity Level

Fig 11. Temperature profiles for large and small components

001aac844

temperature

time

minimum peak temperature

= minimum soldering temperature

maximum peak temperature

= MSL limit, damage level

peak

temperature

Table 9.

Abbreviations

Acronym

Description

BiCMOS

Bipolar Complementary Metal-Oxide Semiconductor

CDM

Charged-Device Model

DUT

Device Under Test

ESD

ElectroStatic Discharge

HBM

Human Body Model

Inter-Integrated Circuit bus

MM

Machine Model

RC

Resistor-Capacitor network

SMBus

System Management Bus