MPC8315E datasheet(101/112 Pages) FREESCALE

101 / 112 page

MPC8315E PowerQUICC™ II Pro Processor Hardware Specifications, Rev. 0

Freescale Semiconductor

101

Thermal (Preliminary)

25 Thermal (Preliminary)

This section describes the thermal specifications of the MPC8315E.

25.1

Thermal Characteristics

Table 78 provides the package thermal characteristics for the 620 29

× 29 mm TEPBGA II.

0010

0000100

66.67

133.33

266.66

0100

0000101

33.33

133.33

333.33

0101

0000101

125

312.5

0010

0000101

66.67

133.33

333.33

0101

0000110

125

375

0100

0000110

33.33

133.33

400

0010

0000110

66.67

133.33

400

Table 78. Package Thermal Characteristics for TEPBGA II

Characteristic

Board type

Symbol

Value

Unit

Notes

Junction to ambient natural convection

Single layer board (1s)

RθJA

°C/W

1, 2

Junction to ambient natural convection

Four layer board (2s2p)

RθJA

°C/W

1, 2, 3

Junction to ambient (@200 ft/min)

Single layer board (1s)

RθJMA

°C/W

1, 3

Junction to ambient (@200 ft/min)

Four layer board (2s2p)

RθJMA

°C/W

1, 3

Junction to board

—

RθJB

8°C/W

Junction to case

—

RθJC

6°C/W

Junction to package top

Natural convection

6°C/W

Notes:

1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal

resistance.

2. Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9 specification.

3. Per JEDEC JESD51-6 with the board horizontal.

4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured

on the top surface of the board near the package.

5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883

Method 1012.1).

6. Thermal characterization parameter indicating the temperature difference between package top and the junction

temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written

as Psi-JT.

Table 77. Suggested PLL Configurations

Conf. No.

SPMF

Core\PLL

Input Clock Frequency (MHz) CSB Frequency (MHz) Core Frequency (MHz)

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