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PPC8567ECVTAQJGA Datasheet(PDF) 99 Page - Freescale Semiconductor, Inc |
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PPC8567ECVTAQJGA Datasheet(HTML) 99 Page - Freescale Semiconductor, Inc |
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99 / 139 page  MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1 Freescale Semiconductor 99 Package and Pinout 22 Package and Pinout This section details package parameters, pin assignments, and dimensions. 22.1 Package Parameters for the MPC8568E FC-PBGA The package parameters are as provided in the following list. The package type is 33mm × 33mm, 1023 flip chip plastic ball grid array (FC-PBGA). Package outline 33 mm × 33 mm Interconnects 1023 Pitch 1 mm Module height 2.23 – 2.75 mm Solder Balls 96.5% Sn 3.5% Ag Ball diameter (typical) 0.6 mm 22.2 Mechanical Dimensions of the MPC8568E FC-PBGA Figure 68 shows the top view, bottom and side view of the MPC8568E 1023 FC-PBGA package. |
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