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MPC8533E Datasheet(PDF) 97 Page - Freescale Semiconductor, Inc |
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MPC8533E Datasheet(HTML) 97 Page - Freescale Semiconductor, Inc |
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97 / 112 page ![]() MPC8533E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 4 Freescale Semiconductor 97 Thermal Heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit board (see Figure 57). Therefore, the synthetic grease offers the best thermal performance, especially at the low interface pressure. Figure 59. Thermal Performance of Select Thermal Interface Materials The system board designer can choose between several types of thermal interface. There are several commercially-available thermal interfaces provided by the following vendors: Chomerics, Inc. 781-935-4850 77 Dragon Ct. Woburn, MA 01801 Internet: www.chomerics.com Dow-Corning Corporation800-248-2481 Corporate Center P.O.Box 999 Midland, MI 48686-0997 Internet: www.dow.com Shin-Etsu MicroSi, Inc.888-642-7674 10028 S. 51st St. Phoenix, AZ 85044 Internet: www.microsi.com The Bergquist Company800-347-4572 18930 West 78th St. 0 0.5 1 1.5 2 0 1020 30 4050 607080 Silicone Sheet (0.006 in.) Bare Joint Floroether Oil Sheet (0.007 in.) Graphite/Oil Sheet (0.005 in.) Synthetic Grease Contact Pressure (psi) |
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