33981 datasheet(34/37 Pages) FREESCALE

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Analog Integrated Circuit Device Data

Freescale Semiconductor

33981

ADDITIONAL DOCUMENTATION

THERMAL ADDENDUM (REV 2.0)

Figure 45. Thermal Test Board

Device on Thermal Test Board

RθJA is the thermal resistance between die junction and

ambient air

This device is a dual die package. Index m indicates the

die that is heated. Index n refers to the number of the die

where the junction temperature is sensed.

16-Pin PQFN

0.90 mm Pitch

12.0mm x 12.0mm Body

33981 Pin Connections

Transparent Top View

with exposed pads

OUT

GND

VPWR

Material:

Single layer printed circuit board

FR4, 1.6 mm thickness

Cu traces, 0.07 mm thickness

Outline:

80 mm x 100 mm board area,

including edge connector for thermal

testing

Area A:

Cu heat-spreading areas on board

surface

Ambient Conditions:

Natural convection, still air

Table 8. Thermal Resistance Performance

Thermal

Resistance

Area A

(mm2)

1 = Power Chip, 2 = Logic Chip (

°C/W)

m = 1,

n = 1

m = 1, n = 2

m = 2, n = 1

m = 2,

n = 2

ΡθJAmn

300

600

33981 Datasheet(PDF) 34 Page - Freescale Semiconductor, Inc

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