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LPC1850 Datasheet(PDF) 59 Page - NXP Semiconductors |
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LPC1850 Datasheet(HTML) 59 Page - NXP Semiconductors |
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59 / 142 page ![]() LPC1850_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Preliminary data sheet Rev. 2.2 — 9 September 2011 59 of 142 NXP Semiconductors LPC1850/30/20/10 32-bit ARM Cortex-M3 microcontroller [1] x = available; - = not pinned out. [2] I = input, O = output, IA = inactive; PU = pull-up enabled (weak pull-up resistor pulls up pin to VDD(IO)); F = floating. [3] 5 V tolerant pad with 15 ns glitch filter; provides digital I/O functions with TTL levels and hysteresis; normal drive strength. [4] 5 V tolerant pad with 15 ns glitch filter providing digital I/O functions with TTL levels, and hysteresis; high drive strength. [5] 5 V tolerant pad with 15 ns glitch filter providing high-speed digital I/O functions with TTL levels and hysteresis. [6] 5 V tolerant pad providing digital I/O functions (with TTL levels and hysteresis) and analog input or output. When configured as a ADC input or DAC output, the pin is not 5 V tolerant and the digital section of the pad must be disabled by setting the pin to an input function and disabling the pull-up resistor through the pin’s SFSP register. [7] 5 V tolerant transparent analog pad. [8] Transparent analog pad. Not 5 V tolerant. [9] Pad provides USB functions. It is designed in accordance with the USB specification, revision 2.0 (Full-speed and Low-speed mode only). This pad is not 5 V tolerant. [10] Open-drain 5 V tolerant digital I/O pad, compatible with I2C-bus 400 kHz specification. This pad requires an external pull-up to provide output functionality. When power is switched off, this pin connected to the I2C-bus is floating and does not disturb the I2C lines. Open-drain configuration applies to all functions on this pin. [11] 5 V tolerant pad with 20 ns glitch filter; provides digital I/O functions with open-drain output with weak pull-up resistor and hysteresis. [12] On the TFBGA100 package, VPP is internally connected to VDDIO. [13] On the LQFP144 package, VSSIO and VSS are connected to a common ground plane. [14] On the TFBGA100 and LQFP100 packages, VSS is internally connected to VSSIO. VSSIO C4, D13, G6, G7, G8, H8, H9, J8, J9, K9, K10, M13, P7, P13 x- x 4, 40, 76, 109 - [13] [14] - - Ground. VSSA B2 x C2 x 135 94 - - Analog ground. Not connected -B9 - - - - - - - n.c. Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. Symbol Description |
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