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LPC4350 Datasheet(PDF) 130 Page - NXP Semiconductors |
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LPC4350 Datasheet(HTML) 130 Page - NXP Semiconductors |
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130 / 145 page  LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Objective data sheet Rev. 2.1 — 23 September 2011 130 of 145 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller Fig 45. Package outline of the TFBGA100 package REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA SOT926-1 - - - - - - - - - SOT926-1 05-12-09 05-12-22 UNIT A max mm 1.2 0.4 0.3 0.8 0.65 0.5 0.4 9.1 8.9 9.1 8.9 A1 DIMENSIONS (mm are the original dimensions) TFBGA100: plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.7 mm A2 b D E e2 7.2 e 0.8 e1 7.2 v 0.15 w 0.05 y 0.08 y1 0.1 0 2.5 5 mm scale b e2 e1 e e 1/2 e 1/2 e A C B ∅ v M C ∅ w M ball A1 index area A B C D E F H K G J 2468 10 13579 ball A1 index area B A E D C y C y1 X detail X A A1 A2 |
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