| Electronic Components Datasheet Search |
|
LPC4350 Datasheet(PDF) 133 Page - NXP Semiconductors |
|
|
|||||||||||||||||||||||||||||
LPC4350 Datasheet(HTML) 133 Page - NXP Semiconductors |
|
133 / 145 page ![]() LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Objective data sheet Rev. 2.1 — 23 September 2011 133 of 145 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller 15. Soldering Fig 48. Reflow soldering of the LBGA256 package DIMENSIONS in mm PSL SP SR Hx Hy Hx Hy SOT740-2 solder land plus solder paste occupied area Footprint information for reflow soldering of LBGA256 package solder land solder paste deposit solder resist P P SL SP SR Generic footprint pattern Refer to the package outline drawing for actual layout detail X see detail X sot740-2_fr 1.00 0.450 0.450 0.600 17.500 17.500 |
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |