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LPC4350 Datasheet(PDF) 136 Page - NXP Semiconductors |
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LPC4350 Datasheet(HTML) 136 Page - NXP Semiconductors |
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136 / 145 page ![]() LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Objective data sheet Rev. 2.1 — 23 September 2011 136 of 145 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller Fig 51. Reflow soldering of the LQFP144 package SOT486-1 DIMENSIONS in mm occupied area Footprint information for reflow soldering of LQFP144 package Ax Bx Gx Gy Hy Hx Ay By P1 P2 D2 (8 ×) D1 (0.125) Ax Ay Bx By D1 D2 Gx Gy Hx Hy P1 P2 C sot486-1_fr solder land C Generic footprint pattern Refer to the package outline drawing for actual layout 23.300 23.300 20.300 20.300 0.500 0.560 0.280 1.500 0.400 20.500 20.500 23.550 23.550 |
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