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STM32F405XX Datasheet(PDF) 21 Page - STMicroelectronics

Part # STM32F405XX
Description  USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces & camera
PDF  154 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32F405XX Datasheet(HTML) 21 Page - STMicroelectronics

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STM32F405xx, STM32F407xx
Description
Doc ID 022152 Rev 1
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pulse width shorter than the Internal APB2 clock period. Up to 140 GPIOs can be connected
to the 16 external interrupt lines.
2.2.12
Clocks and startup
On reset the 16 MHz internal RC oscillator is selected as the default CPU clock. The
16 MHz internal RC oscillator is factory-trimmed to offer 1% accuracy over the full
temperature range. The application can then select the system clock between the RC
oscillator and an external 4-26 MHz clock source. This clock can be monitored for failure. If a
failure is detected, the system automatically switches back to the internal RC oscillator and
a software interrupt is generated (if enabled). This clock source is input to a PLL thus
allowing to increase the frequency up to 168 MHz. Similarly, full interrupt management of
the PLL clock entry is available when necessary (for example if an indirectly used external
oscillator fails).
Several prescalers allow the configuration of the two AHB buses, the high-speed APB
(APB2) and the low-speed APB (APB1) domains. The maximum frequency of the two AHB
buses is 168 MHz while the maximum frequency of the high-speed APB domains is 84 MHz.
The maximum allowed frequency of the low-speed APB domain is 42 MHz.
The devices embed a dedicated PLL (PLLI2S) which allows to achieve audio class
performance. In this case, the I2S master clock can generate all standard sampling
frequencies from 8 kHz to 192 kHz.
2.2.13
Boot modes
At startup, boot pins are used to select one out of three boot options:
Boot from user Flash
Boot from system memory
Boot from embedded SRAM
The boot loader is located in system memory. It is used to reprogram the Flash memory by
using USART1 (PA9/PA10), USART3 (PC10/PC11 or PB10/PB11), CAN2 (PB5/PB6), USB
OTG FS in Device mode (PA9/PA11/PA12) through DFU (device firmware upgrade).
2.2.14
Power supply schemes
VDD = 1.8 to 3.6 V: external power supply for I/Os and the internal regulator (when
enabled), provided externally through VDD pins.
VSSA, VDDA = 1.8 to 3.6 V: external analog power supplies for ADC, DAC, Reset blocks,
RCs and PLL. VDDA and VSSA must be connected to VDD and VSS, respectively.
VBAT = 1.65 to 3.6 V: power supply for RTC, external clock 32 kHz oscillator and backup
registers (through power switch) when VDD is not present.
Refer to Figure 18: Power supply scheme for more details.
Note:
VDD/VDDA minimum value of 1.7 V is obtained when the device operates in the 0 to 70 °C
temperature range with PDR_ON connected to VSS.



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