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MK30DX64VMB7 Datasheet(PDF) 31 Page - Freescale Semiconductor, Inc |
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MK30DX64VMB7 Datasheet(HTML) 31 Page - Freescale Semiconductor, Inc |
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31 / 72 page  6.3.3.2 32kHz oscillator frequency specifications Table 17. 32kHz oscillator frequency specifications Symbol Description Min. Typ. Max. Unit Notes fosc_lo Oscillator crystal — 32.768 — kHz tstart Crystal start-up time — 1000 — ms 1 1. Proper PC board layout procedures must be followed to achieve specifications. 6.4 Memories and memory interfaces 6.4.1 Flash electrical specifications This section describes the electrical characteristics of the flash memory module. 6.4.1.1 Flash timing specifications — program and erase The following specifications represent the amount of time the internal charge pumps are active and do not include command overhead. Table 18. NVM program/erase timing specifications Symbol Description Min. Typ. Max. Unit Notes thvpgm4 Longword Program high-voltage time — 7.5 18 μs thversscr Sector Erase high-voltage time — 13 113 ms 1 thversblk32k Erase Block high-voltage time for 32 KB — 52 452 ms 1 thversblk256k Erase Block high-voltage time for 256 KB — 104 904 ms 1 1. Maximum time based on expectations at cycling end-of-life. 6.4.1.2 Flash timing specifications — commands Table 19. Flash command timing specifications Symbol Description Min. Typ. Max. Unit Notes trd1blk32k trd1blk256k Read 1s Block execution time • 32 KB data flash • 256 KB program flash — — — — 0.5 1.7 ms ms trd1sec1k Read 1s Section execution time (data flash sector) — — 60 μs 1 trd1sec2k Read 1s Section execution time (program flash sector) — — 60 μs 1 Table continues on the next page... Peripheral operating requirements and behaviors K30 Sub-Family Data Sheet, Rev. 2, 4/2012. Freescale Semiconductor, Inc. 31 |
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