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CDCP1803MRGETEP Datasheet(PDF) 10 Page - Texas Instruments |
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CDCP1803MRGETEP Datasheet(HTML) 10 Page - Texas Instruments |
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10 / 24 page ![]() 1 10 100 1000 80 90 100 110 120 130 140 150 160 Continuous TJ (°C) Wirebond Voiding Fail Mode Electromigration Fail Mode CDCP1803-EP SCAS864 – DECEMBER 2008........................................................................................................................................................................................... www.ti.com (1) See data sheet for absolute maximum and minimum recommended operating conditions. (2) Silicon operating life design goal is 10 years at 105°C junction temperature (does not include package interconnect life). Figure 5. Operating Life Derating Chart 10 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s) :CDCP1803-EP |
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