CDCP1803MRGETEP datasheet(12/24 Pages) TI1

12 / 24 page

PARAMETER MEASUREMENT INFORMATION

tpd(LH1)

tpd(LH2)

NOTES: A. Output skew, tsk(o), is calculated as the greater of:

− The difference between the fastest and the slowest tpd(LH)n (n = 0…2)

− The difference between the fastest and the slowest tpd(HL)n (n = 0…2)

B. Part-to-part skew, tsk(pp), is calculated as the greater of:

− The difference between the fastest and the slowest tpd(LH)n (n = 0…2 for LVPECL, n = 3 for LVCMOS) across multiple devices

− The difference between the fastest and the slowest tpd(HL)n (n = 0…2 for LVPECL, n = 3 for LVCMOS) across multiple devices

C. Pulse skew, tsk(p), is calculated as the magnitude of the absolute time difference between the high-to-low (tpd(HL) and the low-to-high

(tpd(LH)) propagation delays when a single switching input causes one or more outputs to switch, tsk(p) = | tpd(HL) − tpd(LH) |. Pulse skew

is sometimes referred to as pulse width distortion or duty cycle skew.

T0067-02

|Yn*Yn|

VOH

VOL

80%

20%

0 V

VOUT(pp)

T0058-02

PCB DESIGN FOR THERMAL FUNCTIONALITY

CDCP1803-EP

SCAS864 – DECEMBER 2008........................................................................................................................................................................................... www.ti.com

Figure 7. Waveforms for Calculation of tsk(o) and tsk(pp)

Figure 8. LVPECL Differential Output Voltage and Rise/Fall Time

It is recommended to take special care of the PCB design for good thermal flow from the QFN 24-terminal

package to the PCB.

Due to the three LVPECL outputs, the current consumption of the CDCP1803 is fixed.

JEDEC JESD51-7 specifies thermal conductivity for standard PCB boards.

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