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CLVC1G175MDCKREP Datasheet(PDF) 1 Page - Texas Instruments |
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CLVC1G175MDCKREP Datasheet(HTML) 1 Page - Texas Instruments |
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1 / 14 page ![]() DCK PACKAGE (TOP VIEW) Q 3 4 D 2 GND 5 1 CLK V CC 6 CLR SN74LVC1G175-EP www.ti.com SGLS366A – AUGUST 2006 – REVISED DECEMBER 2010 SINGLE D-TYPE FLIP-FLOP WITH ASYNCHRONOUS CLEAR Check for Samples: SN74LVC1G175-EP 1 FEATURES • Supports 5-V VCC Operation SUPPORTS DEFENSE, AEROSPACE, AND MEDICAL APPLICATIONS • Inputs Accept Voltages to 5.5 V • Controlled Baseline • Max tpd of 4.3 ns at 3.3 V • One Assembly/Test Site • Low Power Consumption, 10-mA Max ICC • One Fabrication Site • ±24-mA Output Drive at 3.3 V • Available in Military (–55°C/125°C) • Ioff Supports Partial Power-Down-Mode Temperature Range(1) Operation • Extended Product Life Cycle • Latch-Up Performance Exceeds 100 mA Per • Extended Product-Change Notification JESD 78, Class II • Product Traceability • ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101) (1) Additional temperature ranges available - contact factory DESCRIPTION/ORDERING INFORMATION This single D-type flip-flop is designed for 1.65-V to 5.5-V VCC operation. The SN74LVC1G175 has an asynchronous clear (CLR) input. When CLR is high, data from the input pin (D) is transferred to the output pin (Q) on the clock's (CLK) rising edge. When CLR is low, Q is forced into the low state, regardless of the clock edge or data on D. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. ORDERING INFORMATION(1) TA PACKAGE(2) ORDERABLE PART NUMBER TOP-SIDE MARKING(3) –55°C to 125°C SOT (SC-70) – DCK Reel of 3000 CLVC1G175MDCKREP BUD (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web site at www.ti.com. (2) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. (3) The actual top-side marking has one additional character that designates the assembly/test site. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Copyright © 2006–2010, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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