No.

1

動時，在使用之前需要進行電性能確認

2

使用說明Processing Instructions

下面的說明和資訊供用戶正確理解和使用我們公司的石英晶體系列產品，預防不當的加工方式

對石英晶體的損壞，確保用戶設備的可靠性

The following instructions and information are provided for the purpose of having the user understand

the proper way to process our crystal products to prevent problems prior to use and enhance the reliability

of the equipment to which they are applied.

PROCESSING INSTRUCTIONS

石英晶體意外跌落When dropped by mistake

設計和製造的石英晶體本身具有耐衝擊能力,但是當石英晶體元件經受劇烈的機械衝擊，如跌落到地板上或安裝期間劇烈震

The crystal units are designed and manufactured to resist physical shocks.However,when the crystal units are subjected to excessive

impact such as being dropped onto the floor or giving shocks during processing,need to make sure its satisfactory performance

before using it.

焊接Soldering

(1)使用電烙鐵焊接時，引線應該在4秒內焊接完畢，電烙鐵溫度不能高於350℃

Lead wires should be soldered within 4 seconds with the soldering iron heated to a temperature no higher than 350℃

(2)使用浸錫方式焊接時，引線應該在10秒內焊接完畢，焊錫溫度不能高於260℃，並且注意不能將整個晶體浸錫.推薦使用垂

直安裝方式

避免熱力直接傳導到晶體上

直安裝方式，避免熱力直接傳導到晶體上

In solder-dip processing,the leads should be soldered within 10 seconds with a temperature no higher than 260℃.Mounting

in upright is recommendable to prevent the heat conduction directly to the body of the crystal unit.

(3)使用波峰焊接时，请参照下面的波峰焊温度曲线

The WAVE SOLDERING PROFILE as below is recommended for TDXLF-308 tuning fork crystal resonaters.

TDXLF-308

Tuning Fork Crystal Units