S29GL01GP datasheet(16/81 Pages) SPANSION

16 / 81 page

S29GL-P MirrorBit® Flash Family

S29GL-P_00_A14 October 22, 2012

Da ta

Sh e e t

4.4

TS056—56-Pin Standard Thin Small Outline Package (TSOP)

Figure 4.4 56-Pin Thin Small Outline Package (TSOP), 14 x 20 mm

NOTES:

CONTROLLING DIMENSIONS ARE IN MILLIMETERS (mm).

(DIMENSIONING AND TOLERANCING CONFORMS TO ANSI Y14.5M-1982.)

PIN 1 IDENTIFIER FOR STANDARD PIN OUT (DIE UP).

TO BE DETERMINED AT THE SEATING PLANE -C- . THE SEATING PLANE IS

DEFINED AS THE PLANE OF CONTACT THAT IS MADE WHEN THE PACKAGE

LEADS ARE ALLOWED TO REST FREELY ON A FLAT HORIZONTAL SURFACE.

DIMENSIONS D1 AND E DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE

MOLD PROTUSION IS 0.15 mm PER SIDE.

DIMENSION b DOES NOT INCLUDE DAMBAR PROTUSION. ALLOWABLE

DAMBAR PROTUSION SHALL BE 0.08 mm TOTAL IN EXCESS OF b

DIMENSION AT MAX MATERIAL CONDITION. MINIMUM SPACE BETWEEN

PROTRUSION AND AN ADJACENT LEAD TO BE 0.07 mm.

THESE DIMESIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN

0.10 mm AND 0.25 mm FROM THE LEAD TIP.

LEAD COPLANARITY SHALL BE WITHIN 0.10 mm AS MEASURED FROM THE

SEATING PLANE.

DIMENSION "e" IS MEASURED AT THE CENTERLINE OF THE LEADS.

3160\38.10A

MO-142 (B) EC

TS 56

NOM.

---

1.00

1.20

0.15

1.05

MAX.

---

MIN.

0.95

0.20

0.23

0.17

0.22

0.27

0.17

---

0.16

0.10

---

0.21

0.10

20.00

20.20

19.80

14.00

14.10

13.90

0.60

0.70

0.50

-8˚

0˚

---

0.20

0.08

18.40

18.50

18.30

0.05

0.50 BASIC

JEDEC

PACKAGE

SYMBOL

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