LPC81XM datasheet(30/67 Pages) NXP

30 / 67 page

LPC81xM

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Objective data sheet

Rev. 1.0 — 7 November 2012

30 of 67

NXP Semiconductors

LPC81xM

32-bit ARM Cortex-M0+ microcontroller

[8]

The maximum non-operating storage temperature is different than the temperature for required shelf life which should be determined

based on required shelf lifetime. Please refer to the JEDEC spec (J-STD-033B.1) for further details.

[9]

Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k

 series resistor.

Thermal characteristics

The average chip junction temperature, Tj (C), can be calculated using the following

equation:

(1)

• Tamb = ambient temperature (C),

• Rth(j-a) = the package junction-to-ambient thermal resistance (C/W)

• PD = sum of internal and I/O power dissipation

The internal power dissipation is the product of IDD and VDD. The I/O power dissipation of

the I/O pins is often small and many times can be negligible. However it can be significant

in some applications.

amb

th j

–







Table 6.

Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Tj(max)

maximum junction

temperature

--125

C

Table 7.

Thermal resistance (TSSOP packages)

Symbol Parameter

Conditions

Thermal resistance in

C/W

±15 %

TSSOP16

TSSOP20

Rth(j-a)

thermal resistance from

junction to ambient

JEDEC (4.5 in

 4 in); still

air

<tbd>

Single-layer (4.5 in

 3 in);

still air

<tbd>

Rth(j-c)

thermal resistance from

junction to case

<tbd>

Table 8.

Thermal resistance value (SO/DIP packages)

Symbol

Parameter

Conditions

Thermal resistance in

C/W ±15 %

SO20

DIP8

Rth(j-a)

thermal resistance from

junction to ambient

JEDEC (4.5 in

 4 in);

still air

<tbd>

8-layer (4.5 in

 3 in);

still air

<tbd>

Rth(j-c)

thermal resistance from

junction to case

<tbd>

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