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CSD87381P Datasheet(PDF) 10 Page - Texas Instruments

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Part # CSD87381P
Description  Synchronous Buck NexFET Power Block II
PDF  20 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

CSD87381P Datasheet(HTML) 10 Page - Texas Instruments

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VDD
ENABLE
PWM
GND
BOOT
DRVH
LL
DRVL
V
DD
PWM
V
IN
V
OUT
Driver IC
CSD87381P
A
V
Averaging
Circuit
V
A
Output Current (IOUT)
A
Input Current (IIN)
V
Input Voltage (VIN)
Averaged Switch
Node Voltage
(VSW_AVG)
V
IN
V
SW
P
GND
TG
BG
Gate Drive
Voltage (VDD)
CSD87381P
SLPS405B – MARCH 2013 – REVISED MAY 2013
www.ti.com
The CSD87381P NexFET™ power block is an optimized design for synchronous buck applications using 5V gate
drive. The Control FET and Sync FET silicon are parametrically tuned to yield the lowest power loss and highest
system efficiency. As a result, a new rating method is needed which is tailored towards a more systems centric
environment. System level performance curves such as Power Loss, Safe Operating Area, and normalized
graphs allow engineers to predict the product performance in the actual application.
Power Loss Curves
MOSFET centric parameters such as RDS(ON) and Qgd are needed to estimate the loss generated by the devices.
In an effort to simplify the design process for engineers, Texas Instruments has provided measured power loss
performance curves. Figure 1 plots the power loss of the CSD87381P as a function of load current. This curve is
measured by configuring and running the CSD87381P as it would be in the final application (see Figure 27).The
measured power loss is the CSD87381P loss and consists of both input conversion loss and gate drive loss.
Equation 1 is used to generate the power loss curve.
(VIN x IIN) + (VDD x IDD) – (VSW_AVG x IOUT) = Power Loss
(1)
The power loss curve in Figure 1 is measured at the maximum recommended junction temperatures of 125°C
under isothermal test conditions.
Safe Operating Curves (SOA)
The SOA curves in the CSD87381P data sheet provides guidance on the temperature boundaries within an
operating system by incorporating the thermal resistance and system power loss. Figure 3 to Figure 4 outline the
temperature and airflow conditions required for a given load current. The area under the curve dictates the safe
operating area. All the curves are based on measurements made on a PCB design with dimensions of 4” (W) x
3.5” (L) x 0.062” (T) and 6 copper layers of 1 oz. copper thickness.
Normalized Curves
The normalized curves in the CSD87381P data sheet provides guidance on the Power Loss and SOA
adjustments based on their application specific needs. These curves show how the power loss and SOA
boundaries will adjust for a given set of systems conditions. The primary Y-axis is the normalized change in
power loss and the secondary Y-axis is the change is system temperature required in order to comply with the
SOA curve. The change in power loss is a multiplier for the Power Loss curve and the change in temperature is
subtracted from the SOA curve.
Figure 27. Typical Application
10
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Copyright © 2013, Texas Instruments Incorporated



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