CSD87381P datasheet(3/20 Pages) TI

Part #	CSD87381P

Description	Synchronous Buck NexFET Power Block II

PDF	20 Pages

Scroll/Zoom	100%

Manufacturer	TI [Texas Instruments]

Direct Link	http://www.ti.com

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3 / 20 page

CSD87381P

www.ti.com

SLPS405B – MARCH 2013 – REVISED MAY 2013

THERMAL INFORMATION

TA = 25°C (unless otherwise stated)

THERMAL METRIC

MIN

TYP

MAX

UNIT

Junction to ambient thermal resistance (Min Cu) (1)

184

RθJA

Junction to ambient thermal resistance (Max Cu) (2)(1)

°C/W

Junction to case thermal resistance (Top of package) (1)

4.9

RθJC

Junction to case thermal resistance (PGND Pin)

(1)

1.65

(1)

RθJC is determined with the device mounted on a 1-inch

2 (6.45-cm2), 2 oz. (0.071-mm thick) Cu pad on a 1.5-inch × 1.5-inch

(3.81-cm × 3.81-cm), 0.06-inch (1.52-mm) thick FR4 board. RθJC is specified by design while RθJA is determined by the user’s board

design.

(2)

Device mounted on FR4 material with 1-inch2 (6.45-cm2) Cu.

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