DSPIC33FJ32GP302THSLASHSP datasheet(391/403 Pages) MICROCHIP

391 / 403 page

 2009 Microchip Technology Inc.

Preliminary

DS70292D-page 391

dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04, AND dsPIC33FJ128GPX02/X04

Revision D (November 2009)

The revision includes the following global update:

• Added Note 2 to the shaded table that appears at

the beginning of each chapter. This new note

provides information regarding the availability of

registers and their associated bits

This revision also includes minor typographical and

formatting changes throughout the data sheet text.

All other major changes are referenced by their

respective section in the following table.

TABLE A-3:

MAJOR SECTION UPDATES

Section Name

Update Description

“High-Performance, 16-Bit Digital Signal

Controllers”

Added information on high temperature operation (see “Operating

Range:”).

Section 11.0 “I/O Ports”

Changed the reference to digital-only pins to 5V tolerant pins in the

second paragraph of Section 11.2 “Open-Drain Configuration”.

Section 18.0 “Universal Asynchronous

Receiver Transmitter (UART)”

Updated the two baud rate range features to: 10 Mbps to 38 bps at

40 MIPS.

Section 21.0 “10-Bit/12-Bit Analog-to-

Digital Converter (ADC)”

Updated the ADC block diagrams (see Figure 21-1 and Figure 21-2).

Section 22.0 “Audio Digital-to-Analog

Converter (DAC)”

Removed last sentence of the first paragraph in the section.

Added a shaded note to Section 22.2 “DAC Module Operation”.

Updated Figure 22-2: “Audio DAC Output for Ramp Input

(Unsigned)”.

Section 27.0 “Special Features”

Updated the second paragraph and removed the fourth paragraph in

Section 27.1 “Configuration Bits”.

Updated the Device Configuration Register Map (see Table 27-1).

Section 30.0 “Electrical Characteristics”

Updated the Absolute Maximum Ratings for high temperature and

added Note 4.

Removed parameters DI26, DI28, and DI29 from the I/O Pin Input

Specifications (see Table 30-9).

Updated the SPIx Module Slave Mode (CKE = 1) Timing

Characteristics (see Figure 30-12).

Removed Table 30-43: Audio DAC Module Specifications. Original

contents were updated and combined with Table 30-42 of the same

name.

Section 31.0 “High Temperature Electrical

Characteristics”

Added new chapter with high temperature specifications.

“Product Identification System”

Added the “H” definition for high temperature.

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