MPC8245EC datasheet(51/68 Pages) FREESCALE

51 / 68 page

MPC8245 Integrated Processor Hardware Specifications, Rev. 10

Freescale Semiconductor

System Design

Figure 28. Die Junction-to-Ambient Resistance

The board designer can choose between several types of heat sinks to place on the MPC8245. Several

commercially-available heat sinks for the MPC8245 are provided by the following vendors:

Aavid Thermalloy

603-224-9988

80 Commercial St.

Concord, NH 03301

Internet: www.aavidthermalloy.com

Alpha Novatech

408-749-7601

473 Sapena Ct. #15

Santa Clara, CA 95054

Internet: www.alphanovatech.com

International Electronic Research Corporation (IERC) 818-842-7277

413 North Moss St.

Burbank, CA 91502

Internet: www.ctscorp.com

Tyco Electronics

800-522-6752

Chip Coolers™

P.O. Box 3668

Harrisburg, PA 17105-3668

Internet: www.chipcoolers.com

00.5

1.5

22.5

Airflow Velocity (m/s)

No heat sink and high thermal board-level loading of

adjacent components

No heat sink and low thermal board-level loading of

adjacent components

Attached heat sink and high thermal board-level loading of

adjacent components

Attached heat sink and low thermal board-level loading of

adjacent components

MPC8245EC Datasheet(PDF) 51 Page - Freescale Semiconductor, Inc