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MPC8306SEC Datasheet(PDF) 10 Page - Freescale Semiconductor, Inc |
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MPC8306SEC Datasheet(HTML) 10 Page - Freescale Semiconductor, Inc |
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10 / 70 page ![]() MPC8306S PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 1 10 Freescale Semiconductor Power Characteristics Figure 3. MPC8306S Power-Up Sequencing Example 3 Power Characteristics The typical power dissipation for this family of MPC8306S devices is shown in the following table. Table 5. MPC8306S Power Dissipation Core Frequency (MHz) QUICC Engine Frequency (MHz) CSB Frequency (MHz) Typical Maximum Unit Note 133 133 133 0.272 0.618 W 1, 2, 3 200 233 133 0.291 0.631 W 1, 2, 3 266 233 133 0.451 0.925 W 1, 2, 3 333 233 133 0.471 0.950 W 1, 2, 3 Notes: 1. The values do not include I/O supply power (OVDD and GVDD), but it does include VDD and AVDD power. For I/O power values, see Table 6. 2. Typical power is based on a nominal voltage of VDD = 1.0 V, ambient temperature, and the core running a Dhrystone benchmark application. The measurements were taken on the evaluation board using WC process silicon. 3. Maximum power is based on a voltage of VDD = 1.05 V, WC process, a junction TJ = 105C, and a smoke test code. t 90% V Core Voltage (VDD) I/O Voltage (GVDD and OVDD) 0 0.7 V PORESET >= 32 tSYS_CLK_IN |
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