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APL5327 Datasheet(PDF) 9 Page - Anpec Electronics Coropration |
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APL5327 Datasheet(HTML) 9 Page - Anpec Electronics Coropration |
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9 / 14 page ![]() Copyright © ANPEC Electronics Corp. Rev. A.2 - Jun., 2011 APL5327 www.anpec.com.tw 9 Application Information P D = (TJ - TA) / θJA where (T J-TA) is the temperature difference between the junction and ambient air. θ JA is the thermal resistance between Junction and ambient air. Assuming the T A=25 oC and maximum T J=160 oC (typical thermal limit threshold), the maximum power dissipation is calcu- lated as below: P D(max)=(160-25)/240 = 0.56(W) For normal operation, do not exceed the maximum junc- tion temperature rating of T J = 125 oC. The calculated power dissipation should less than: P D =(125-25)/240 = 0.41(W) The GND provides an electrical connection to the ground and channels heat away. Connect the GND to the ground by using a large pad or a ground plane. Input Capacitor The APL5327 requires proper input capacitors to supply surge current during stepping load transients to prevent the input rail from dropping. Because the parasitic induc- tor from the voltage sources or other bulk capacitors to the VIN limit the slew rate of the surge current, place the Input capacitors near VIN as close as possible. Input ca- pacitors should be larger than 1 µF and a minimum ce- ramic capacitor of 1 µF is necessary. Output Capacitor The APL5327 needs a proper output capacitor to main- tain circuit stability and to improve transient response over temperature and current. In order to insure the circuit stability, the proper output capacitor value should be larger than 1 µF. With X5R and X7R dielectrics, 1µF is sufficient at all operating temperatures. Large output capacitor value can reduce noise and improve load-transient response and PSRR, however, it also affects power on issue. Maxi- mum output capacitance should be less than 100 µF. Operation Region and Power Dissipation The APL5327 maximum power dissipation depends on the thermal resistance and temperature difference be- tween the die junction and ambient air. The power dissi- pation P D across the device is: Layout Consideration Figure 1 illustrates the layout. Below is a checklist for your layout: 1. Please place the input capacitors close to the VIN. 2. Ceramic capacitors for load must be placed near the load as close as possible. 3. To place APL5327 and output capacitors near the load is good for performance. 4. Large current paths, the bold lines in figure 2, must have wide tracks. 5. Divider resistor R1 and R2 must be placed near the SET as close as possible. Figure 1. Recommended Minimum Footprint SOT-23-5 0.02 0.038 0.076 Unit : Inch VIN GND VOUT 2 1 5 4 APL5327 V OUT C OUT R 1 R 2 SET LOAD C IN V IN |
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