TS68C429AMFBSLASHC datasheet(39/43 Pages) ATMEL

39 / 43 page

TS68C429A

2120A–HIREL–08/02

Figure 36. First FIFO Access

Preparation for

Delivery

Packaging

Microcircuits are prepared for delivery in accordance with MIL-I-38535 or DESC.

Certificate of Compliance Atmel offers a certificate of compliance with each shipment of parts, affirming the prod-

ucts are in compliance either with MIL-STD-883 or DESC and guaranteeing the

parameters not tested at temperature extremes for the entire temperature range.

Handling

MOS devices must be handled with certain precautions to avoid damage due to accu-

mulation of static charge. Input protection devices have been designed in the chip to

minimize the effect of this static buildup. However, the following handling practices are

recommended:

•

Devices should be handled on benches with conductive and grounded surfaces.

•

Ground test equipment, tools and operator.

•

Do not handle devices by the leads.

•

Store devices in conductive foam or carriers.

•

Avoid use of plastic, rubber, or silk in MOS areas.

•

Maintain relative humidity above 50 percent if practical.

TS68C429AMFB/C Datasheet(PDF) 39 Page - ATMEL Corporation