TS68C429AMFBSLASHC datasheet(7/43 Pages) ATMEL

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TS68C429A

2120A–HIREL–08/02

Design and Construction

Terminal Connections

Depending on the package, the terminal connections is detailed in “Terminal Connec-

tions” on page 41.

Package

The circuits are packaged in a hermetically sealed ceramic package which is conform to

case outlines of MIL-STD 1835 (when defined):

•

PGA 84,

•

CQFP 132.

The precise case outlines are described at the end of this specification (“Package

Mechanical Data” on page 40) and into MIL-STD-1835.

Special Recommended

Conditions for CMOS Devices

• CMOS Latch-up

The CMOS cell is basically composed of two complementary transistors (a P-channel

and an N-channel), and, in the steady state, only one transistor is turned-on. The active

P-channel transistor sources current when the output is a logic high and presents a high

impedance when the output is a logic low. Thus the overall result is extremely low power

consumption because there is no power loss through the active P-channel transistor.

Also since only once transistor is determined by leakage currents.

Because the basic CMOS cell is composed of two complementary transistors, a para-

sitic semiconductor controlled rectifier (SCR) formed and may be triggered when an

input exceeds the supply voltage. The SCR that is formed by this high input causes the

device to become “latched” in a mode that may result in excessive current drain and

eventual destruction of the device. Although the device is implemented with input pro-

tection diodes, care should be exercised to ensure that the maximum input voltages

specification is not exceeded from voltage transients; others may require no additional

circuitry.

• CMOS/TTL Levels

The TS68C429A doesn’t satisfy totally the input/output drive requirements of TTL logic

devices, see Table 4.

Electrical Characteristics

Table 1. Absolute Maximum Ratings

Symbol

Parameter

Test Conditions

Min

Max

Unit

Supply Voltage

-0.3

+7.0

Input Voltage

-0.3

+7.0

dmax

Max Power Dissipation

400

case

Operating Temperature

M suffix

-55

+125

°C

V suffix

-40

+85

°C

stg

Storage Temperature

-55

+150

°C

Junction Temperature

+160

°C

leads

Lead Temperature

Max 5 sec. soldering

+270

°C

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