THS4051

THS4052

SLOS238D − MAY 1999 − REVISED AUGUST 2008

www.ti.com

2

CAUTION: The THS4051 and THS4052 provide ESD protection circuitry. However, permanent damage can still occur if this device

is subjected to high-energy electrostatic discharges. Proper ESD precautions are recommended to avoid any performance

degradation or loss of functionality.

ABSOLUTE MAXIMUM RATINGS OVER OPERATING FREE-AIR TEMPERATURE (UNLESS

±16.5 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

150 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

±4 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Continuous total power dissipation

See Dissipation Rating Table

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

150

°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

0

°C to 70°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

I-suffix

−40

°C to 85°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

M-suffix

−55

°C to 125°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

−65

°C to 150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds

300

°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds, JG package

300

°C

. . . . . . . . . . . . . . . . . . .

Case temperature for 60 seconds, FK package

260

°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

DISSIPATION RATING TABLE

PACKAGE

θJA

θJC

TA = 25°C

PACKAGE

θJA

(

°C/W)

θJC

(

°C/W)

TA = 25 C

POWER RATING

D

167‡

38.3

740 mW

DGN§

58.4

4.7

2.14 W

JG

119

28

1050 mW

FK

87.7

20

1375 mW

‡ This data was taken using the JEDEC standard Low-K test PCB. For the JEDEC Proposed High-K

test PCB, the

θJA is 95°C/W with a power rating at TA = 25°C of 1.32 W.

§ This data was taken using 2 oz. trace and copper pad that is soldered directly to a 3 in. × 3 in. PC.

For further information, refer to Application Information section of this data sheet.

RECOMMENDED OPERATING CONDITIONS

MIN

NOM

MAX

UNIT

Supply voltage, VCC+ and VCC−

Dual supply

±4.5

±16

V

Supply voltage, VCC+ and VCC−

Single supply

9

32

V

C-suffix

0

70

Operating free-air temperature, TA

I-suffix

−40

85

°C

Operating free-air temperature, TA

M-suffix

−55

125

C