THS4051

THS4052

SLOS238D − MAY 1999 − REVISED AUGUST 2008

www.ti.com

3

PACKAGED DEVICES

TA

NUMBER

OF

CHANNELS

PLASTIC

SMALL

OUTLINE†

PLASTIC MSOP†

(DGN)

CERAMIC DIP

(JG)

CHIP

CARRIER

EVALUATION

MODULE

CHANNELS

OUTLINE†

(D)

DEVICE

SYMBOL

(JG)

CARRIER

(FK)

MODULE

0

°C to 70°C

1

THS4051CD

THS4051CDGN

ACQ

—

—

THS4051EVM

0

°C to 70°C

2

THS4052CD

THS4052CDGN‡

ACE

—

—

THS4052EVM

−40

°C to 85°C

1

THS4051ID

THS4051IDGN

ACR

—

—

—

−40

°C to 85°C

2

THS4052ID

THS4052IDGN‡

ACF

—

—

—

−55

°C to 125°C

1

—

—

—

THS4051MJG

THS4051MFK

—

(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site

at www.ti.com.

† The D and DGN packages are available taped and reeled. Add an R suffix to the device type (i.e., THS4051CDGN).

‡ This device is in the Product Preview stage of development. Please contact your local TI sales office for availability.

FUNCTIONAL BLOCK DIAGRAM

OUT

8

6

1

IN−

IN+

2

3

Null

Figure 1. THS4051 − Single Channel

1OUT

1IN−

1IN+

VCC

2OUT

2IN−

2IN+

−VCC

Figure 2. THS4052 − Dual Channel

−100

−90

−80

−70

−60

−50

−40

T

OT

AL

HARMONIC DISTORTION

vs

FREQUENCY

f - Frequency - Hz

20M

10M

100k

1M

VCC = ± 15 V

Gain = 2

VO(PP) = 2 V

RL = 150 Ω

RL = 1 kΩ