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SI7635DP Datasheet(PDF) 1 Page - Vishay Siliconix |
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SI7635DP Datasheet(HTML) 1 Page - Vishay Siliconix |
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1 / 9 page  Vishay Siliconix Si7635DP Document Number: 65021 S11-1141-Rev. B, 13-Jun-11 www.vishay.com 1 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 P-Channel 20-V (D-S) MOSFET FEATURES • Halogen-free According to IEC 61249-2-21 Definition • TrenchFET® Power MOSFET • 100 % Rg Tested • Compliant to RoHS Directive 2002/95/EC APPLICATIONS • Load Switch • Adaptor/Battery Switch PRODUCT SUMMARY VDS (V) RDS(on) (Ω) ID (A) a, g Qg (Typ.) - 20 0.0049 at VGS = 10 V - 40 21.5 nC 0.0075 at VGS = 4.5 V - 40 Ordering Information: Si7635DP-T1-GE3 (Lead (Pb)-free and Halogen-free) 1 2 3 4 5 6 7 8 S S S G D D D D 6.15 mm 5.15 mm PowerPAK® SO-8 Bottom View S G D P-Channel MOSFET Notes: a. Based on TC = 25 °C. b. Surface Mounted on 1" x 1" FR4 board. c. t = 10 s. d. See Solder Profile ( www.vishay.com/doc?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection. e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components. f. Maximum under Steady State conditions is 65 °C/W. g. Package Limited. ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted) Parameter Symbol Limit Unit Drain-Source Voltage VDS - 20 V Gate-Source Voltage VGS ± 16 Continuous Drain Current (TJ = 150 °C) TC = 25 °C ID - 40g A TC = 70 °C - 40g TA = 25 °C - 26b, c TA = 70 °C - 21b, c Pulsed Drain Current IDM - 70 Continuous Source-Drain Diode Current TC = 25 °C IS - 40g TA = 25 °C - 4.5b, c Maximum Power Dissipation TC = 25 °C PD 54 W TC = 70 °C 34.7 TA = 25 °C 5.0b, c TA = 70 °C 3.2b, c Operating Junction and Storage Temperature Range TJ, Tstg - 55 to 150 °C Soldering Recommendations (Peak Temperature)d, e 260 THERMAL RESISTANCE RATINGS Parameter Symbol Typical Maximum Unit Maximum Junction-to-Ambientb, f t ≤ 10 s RthJA 20 25 °C/W Maximum Junction-to-Case (Drain) Steady State RthJC 1.8 2.3 |
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