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Die Characteristics

DIE DIMENSIONS:

249.2 x 290.9 x 19

±1mils

METALLIZATION:

Type: Silicon - Aluminum

Thickness: 11k

Å

GLASSIVATION:

Thickness: 8k

Å

WORST CASE CURRENT DENSITY:

Metallization Mask Layout

80C88

A11

A12

A13

A14

A17/S4 A18/S5

GND

A16/S3

A15

A19/S6

SSO

MN/MX

RD

A10

A9

A8

AD7

AD6

AD5

AD4

AD3

AD2

AD1

AD0

NMI

INTR CLK

GND

RESET READY TEST

ALE

DEN

HOLD

HLDA

WR

IO/M

DT/R

INTA

80C88