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TN0873 Datasheet(PDF) 7 Page - STMicroelectronics |
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TN0873 Datasheet(HTML) 7 Page - STMicroelectronics |
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7 / 11 page ![]() DocID022757 Rev 4 7/11 TN0873 Deliverables and ordering information 11 2.2 Premium option 2.2.1 Description of the Premium option In addition to parts and CoC provided as per the Standard option, the Premium option gives access to a complete set of qualification data of the specific wafers used for the parts, in compliance with either of the supported options of the ECSS-Q-ST-60-05C specification. This data is obtained from parts specifically processed, which are therefore sent together with the dice. The documentation set consists of: • Certificate of conformance including: – Customer purchase order number – Wafer lot traceability – Detailed specification used for associated packaged parts – Reference of the manufacturing lot traveller for the die item – Reference of the manufacturing lot traveller for the customer qualification lot • RVT report (if applicable) • S.E.M report (if applicable) • Result for each part (25 by default) of the wafer qualification lot of each of the electrical tests described in the ESCC detail specification (steps 3, 4, 5, 6, 7, 9, 10, 11, and 13 of Table 2). • Die layout The parts used to qualify the wafer are shipped together with the dice and the documentation in strip pack containers. Each sample is marked with its part number (example: 2N2222AHR, 54HC00K or HCC4001BK) and its serial number. The strip pack is marked with the part number of the component, its serial number and the corresponding manufacturing traveller lot number. It is packed in an individual antistatic strip pack (intermediate packing) labeled as follows: • PO number • Part number • Marking • Date code • Quantity of pieces • OC number and item • Serial number |
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