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TN0873 Datasheet(PDF) 4 Page - STMicroelectronics |
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TN0873 Datasheet(HTML) 4 Page - STMicroelectronics |
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4 / 11 page ![]() Space-grade description TN0873 4/11 DocID022757 Rev 4 1.4.4 Wafer qualification Wafers eligible for the ST space-grade level (see Section 1.1) are screened as described in Table 2. Only wafers that have been successfully screened can be used to produce dice of the ST space-grade level. Table 2. Space-grade level Step # Step definition Conditions Acceptance level n = 25(1) Acceptance level n = 38(1) 1 Samples assembly(2) According to the ST qualified PID as applicable (3) (3) 2 Serialization(4) n samples 3 Electrical test read and record at 25 °C As per ESCC detail specification (DC/AC parameters for ICs or DC for discrete) A2/R3(5) A3/R4(5) 4 Electrical test read and record at -55 °C/+125 °C(6) As per ESCC detail specification (DC parameters) 5 Electrical test read and record at 25 °C for drift parameters As per ESCC detail specification drift table -/- -/- 6 High temperature reverse bias(6) As per ESCC detail specification conditions -/- -/- 7 Electrical test read and record at 25°C for drift parameters(6) As per ESCC detail specification drift table A1/R2 A2/R3 8 Burn-in (240 hrs) As per ESCC detail specification conditions -/- -/- 9 Electrical test read and record at 25° C for drift parameters As per ESCC detail specification drift table A1/R2 A2/R3 10 Electrical test read and record at 25 °C As per ESCC detail specification (DC/AC parameters or DC for discrete) A2/R3 A3/R4 11 Electrical test read and record at -55 °C/+125 °C As per ESCC detail specification (DC parameters) 12 Life test 1000 hrs As per ESCC detail specification conditions -/- -/- 13 Electrical test read and record at 25 °C As per ESCC detail specification end- point electrical measurements A0/R1 A0/R1 14 Check for lot failure Check from step 3 to step 11 A2/R3 A3/R4 1. Ax/Ry: accepted if x rejects or less / refused if y rejects or more. 2. According to applicable ESCC 5000 or ESCC 9000 (chart F2 and F3 up to PIND test). 3. The number of samples allows the qualification of up to 3 wafers, therefore limiting the maximum quantity of the product in die form per line item to: 1000 dice maximum per line item for the 54HCMOS/CMOS4000B and diodes, and 5000 dice maximum per line item for bipolar transistors. The number of samples can be increased in the Premium option. Contact ST for the corresponding acceptance level. 4. Sample size and acceptance criteria are based on the ECSS-Q-ST-60-05C specification, with limited sample size to 25 and 38 pieces. Data provided are for the default 25 samples. 5. Electrical rejects are not counted as failures if due to the ST assembly process. 6. Electrical tests at high/low temp and/or HTRB are optional and shall be done only on customer request and specified on the purchase order at additional cost. |
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