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TN0873 Datasheet(PDF) 4 Page - STMicroelectronics

Part # TN0873
Description  DIE2HR/D2HR manufacturing and quality specification
PDF  11 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

TN0873 Datasheet(HTML) 4 Page - STMicroelectronics

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Space-grade description
TN0873
4/11
DocID022757 Rev 4
1.4.4
Wafer qualification
Wafers eligible for the ST space-grade level (see Section 1.1) are screened as described in
Table 2. Only wafers that have been successfully screened can be used to produce dice of
the ST space-grade level.
Table 2. Space-grade level
Step #
Step definition
Conditions
Acceptance
level n = 25(1)
Acceptance
level n = 38(1)
1
Samples assembly(2)
According to the ST qualified PID as
applicable
(3)
(3)
2
Serialization(4)
n samples
3
Electrical test read and record
at 25 °C
As per ESCC detail specification (DC/AC
parameters for ICs or DC for discrete)
A2/R3(5)
A3/R4(5)
4
Electrical test read and record
at -55 °C/+125 °C(6)
As per ESCC detail specification (DC
parameters)
5
Electrical test read and record
at 25 °C for drift parameters
As per ESCC detail specification drift
table
-/-
-/-
6
High temperature reverse
bias(6)
As per ESCC detail specification
conditions
-/-
-/-
7
Electrical test read and record
at 25°C for drift parameters(6)
As per ESCC detail specification drift
table
A1/R2
A2/R3
8
Burn-in (240 hrs)
As per ESCC detail specification
conditions
-/-
-/-
9
Electrical test read and record
at 25° C for drift parameters
As per ESCC detail specification drift
table
A1/R2
A2/R3
10
Electrical test read and record
at 25 °C
As per ESCC detail specification (DC/AC
parameters or DC for discrete)
A2/R3
A3/R4
11
Electrical test read and record
at -55 °C/+125 °C
As per ESCC detail specification (DC
parameters)
12
Life test 1000 hrs
As per ESCC detail specification
conditions
-/-
-/-
13
Electrical test read and record
at 25 °C
As per ESCC detail specification end-
point electrical measurements
A0/R1
A0/R1
14
Check for lot failure
Check from step 3 to step 11
A2/R3
A3/R4
1. Ax/Ry: accepted if x rejects or less / refused if y rejects or more.
2. According to applicable ESCC 5000 or ESCC 9000 (chart F2 and F3 up to PIND test).
3. The number of samples allows the qualification of up to 3 wafers, therefore limiting the maximum quantity of the product in
die form per line item to: 1000 dice maximum per line item for the 54HCMOS/CMOS4000B and diodes, and 5000 dice
maximum per line item for bipolar transistors. The number of samples can be increased in the Premium option. Contact ST
for the corresponding acceptance level.
4. Sample size and acceptance criteria are based on the ECSS-Q-ST-60-05C specification, with limited sample size to 25 and
38 pieces. Data provided are for the default 25 samples.
5. Electrical rejects are not counted as failures if due to the ST assembly process.
6. Electrical tests at high/low temp and/or HTRB are optional and shall be done only on customer request and specified on the
purchase order at additional cost.



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