DocID023948 Rev 1

11/16

AN4208

Soldering assembly recommendations

16

mounting on PCB (definitions)

Dwell time in the soldering zone (with temperature higher than 220 °C) has to be kept as

short as possible to prevent component and substrate damages. Peak temperature must

reflow, specially above 150 °C.

Flip Chips are able to withstand three times the previous recommended reflow profile to be

compatible with a double reflow when SMDs are mounted on both sides of the PCB plus

one additional repair.

A maximum of three soldering reflows are allowed for these lead-free packages (with repair

step included).

The use of a no-clean paste is highly recommended to avoid any cleaning operation. To

prevent any bump cracks, ultrasonic cleaning methods are not recommended.

5.3

Underfilling

Underfilling is not essential for Flip Chips. These devices can do without an underfill if the

process temperature does not exceed 175 °C and if the process time is short (typically 5

minutes).

on PCB (value)

Profile

Value

Typical

Max.

Temp. gradient in preheat (T = 70 – 180 °C)

0.9 °C/s

3 °C/s

Temp. gradient (T = 200 – 225 °C)

2 °C/s

3 °C/s

Peak temp. in reflow

240 - 245 °C

260 °C

Time above 220 °C

60 s

90 s

Temp. gradient in cooling

-2 to - 3 °C/s

-6 °C/s

Time from 50 to 220 °C

160 to 220 s

250

0

50

100

150

200

240

210

180

150

120

90

60

30

300

270

-6°C/s

240-245 °C

2 - 3 °C/s

Temperature (°C)

-2 °C/s

-3 °C/s

Time (s)

0.9 °C/s

60 sec

(90 max)