Thermal measures

AN2755

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Thermal measures

In order to check the design reliability, a thermal mapping by means of an IR camera was

done. Figure 22 and 23 show thermal measures on the board component side at nominal

input voltages and full load. Some pointers visible on the pictures placed across key

components show the relevant temperature. Table 1 provides the correlation between

measured points and components for both thermal maps. The ambient temperature during

both measurements was 27 °C. According to these measurement results, all components of

the board are working within their temperature limits.

Figure 22.

Thermal map at 115 Vac - 60 Hz - full load

Figure 23.

Thermal map at 230 Vac - 50 Hz - full load

°C

80.6

73.9

67.2

60.5

53.8

47.1

40.4

33.7

26.9

°C

79.9

73.2

66.6

60.0

53.3

46.7

40.0

33.4

26.8