TS3USB221A_15 datasheet(4/25 Pages) TI

4 / 25 page

TS3USB221A

SCDS277A – NOVEMBER 2008 – REVISED FEBRUARY 2015

www.ti.com

7 Specifications

7.1 Absolute Maximum Ratings

(1)

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage, VCC

–0.5

4.6

Control input voltage, VS, V OE

(2) (3)

–0.5

Switch I/O voltage, VI/O

(2) (3) (4)

–0.5

Control input clamp current, IIK

VIN < 0

–50

I/O port clamp current, II/OK

VI/O < 0

–50

ON-state switch current, II/O

(5)

±120

Continuous current through VCC or GND

±100

Tstg

Storage temperature range

–65

150

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to ground, unless otherwise specified.

(3)

The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.

(4)

VI and VO are used to denote specific conditions for VI/O.

(5)

II and IO are used to denote specific conditions for II/O.

7.2 ESD Ratings

VALUE

UNIT

Human-body model (HBM), per

All pins except I/O to

±7000

ANSI/ESDA/JEDEC JS-001(1)

GND

V(ESD)

Electrostatic discharge

I/O to GND

±12000

Charged-device model (CDM), per JEDEC

All pins

±1000

specification JESD22-C101(2)

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 500-V HBM is possible with the necessary precautions.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 250-V CDM is possible with the necessary precautions.

7.3 Recommended Operating Conditions

MIN

MAX

UNIT

VCC

Supply voltage

2.3

3.6

VCC = 2.3 V to 2.7 V

0.46 × VCC

VCC

High-level control input voltage

VCC = 2.7 V to 3.6 V

0.46 × VCC

VCC

VS, V OE

VCC = 2.3 V to 2.7 V

0.25 × VCC

Low-level control input voltage

VCC = 2.7 V to 3.6 V

0.25 × VCC

VI/O

Data input/output voltage

5.5

Operating free-air temperature

–40

°C

7.4 Thermal Information

RSE

THERMAL METRIC(1)

UNIT

10 PINS

RθJA

Junction-to-ambient thermal resistance

179.7

RθJC(top)

Junction-to-case (top) thermal resistance

107.9

RθJB

Junction-to-board thermal resistance

100.7

°C/W

ψJT

Junction-to-top characterization parameter

7.1

ψJB

Junction-to-board characterization parameter

100.0

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

Submit Documentation Feedback

Product Folder Links: TS3USB221A

TS3USB221A Datasheet(PDF) 4 Page - Texas Instruments

TS3USB221A Datasheet(HTML) 4 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25

Datasheet Download

Link URL