LM2776DBVT datasheet(4/23 Pages) TI1

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LM2776

SNVSA56A – MAY 2015 – REVISED FEBRUARY 2016

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(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(3)

The maximum allowable power dissipation is calculated by using PDMax = (TJMax − TA) / RθJA, where TJMax is the maximum junction

temperature, TA is the ambient temperature, and RθJA is the junction-to-ambient thermal resistance of the specified package.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

Supply voltage (VIN to GND, or GND to VOUT)

(GND

− 0.3)

(VIN + 0.3)

VOUT continuous output current

250

Operating junction temperature, TJMax

(3)

125

°C

Storage temperature, Tstg

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic

discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±1000

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±250

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Junction temperature

–40

125

°C

Ambient temperature

–40

°C

Input voltage

2.7

5.5

Output current

200

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.4 Thermal Information

THERMAL METRIC(1)

LM2776

UNIT

DBV (SOT)

6 PINS

RθJA

Junction-to-ambient thermal resistance

187

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

158.2

°C/W

RθJB

Junction-to-board thermal resistance

33.3

°C/W

ψJT

Junction-to-top characterization parameter

37.8

°C/W

ψJB

Junction-to-board characterization parameter

32.8

°C/W

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