LM5101CSD datasheet(4/37 Pages) TI1

4 / 37 page

VDD

VSS

MSOP-

PowerPad-8

LM5100A, LM5100B, LM5100C

LM5101A, LM5101B, LM5101C

SNOSAW2Q – SEPTEMBER 2006 – REVISED NOVEMBER 2015

www.ti.com

DGN Package

8-Pin MSOP-PowerPAD

Top View

Pin Functions

I/O

DESCRIPTION

NAME

8 PINS

10 PINS(1)

High-side gate driver bootstrap supply. Connect the positive terminal of the bootstrap

capacitor to HB and the negative terminal to HS. The bootstrap capacitor should be

placed as close to the IC as possible.

High-side driver control input. The LM5100A/B/C inputs have CMOS type thresholds.

The LM5101A/B/C inputs have TTL type thresholds. Unused inputs should be tied to

ground and not left open.

High-side gate driver output. Connect to the gate of high-side MOSFET with a short,

low inductance path.

High-side MOSFET source connection. Connect to the bootstrap capacitor negative

—

terminal and the source of the high-side MOSFET.

Low-side driver control input. The LM5100A/B/C inputs have CMOS type thresholds.

The LM5101A/B/C inputs have TTL type thresholds. Unused inputs should be tied to

ground and not left open.

Low-side gate driver output. Connect to the gate of the low-side MOSFET with a

short, low inductance path.

Positive gate drive supply . Locally decouple to VSS using low ESR/ESL capacitor

VDD

located as close to the IC as possible.

VSS

—

Ground return. All signals are referenced to this ground.

TI recommends that the exposed pad on the bottom of the package is soldered to

EP(2)

—

ground plane on the PC board, and that ground plane should extend out from

beneath the IC to help dissipate heat.

(1)

For WSON-10 package, pins 5 and 6 have no connection.

(2)

Exposed pad is not available on the 8-pin SOIC package.

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Product Folder Links: LM5100A LM5100B LM5100C LM5101A LM5101B LM5101C

LM5101CSD Datasheet(PDF) 4 Page - Texas Instruments

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