LM3445

SNVS570M – JANUARY 2009 – REVISED NOVEMBER 2015

www.ti.com

6 Specifications

6.1 Absolute Maximum Ratings

See

(1) (2) (3)

MIN

MAX

UNIT

BLDR to GND

–0.3

17

V

–0.3

14

V

ISNS to GND

–0.3

2.5

V

ASNS, DIM, FLTR2, COFF to GND

–0.3

7

V

COFF Input Current

100

mA

Internally Limited

150

°C

Storage Temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(3)

All voltages are with respect to the potential at the GND pin, unless otherwise specified.

(4)

6.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

Human Body Model, applicable std. JESD22-A114-C.

(3)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN

MAX

UNIT

8

12

V

Junction Temperature

–40

125

°C

6.4 Thermal Information

LM3445

DGS (VSSOP)

D (SOIC)

UNIT

10 PINS

14 PINS

Junction-to-ambient thermal resistance

159

82.8

°C/W

Junction-to-case (top) thermal resistance

54.5

40.2

°C/W

Junction-to-board thermal resistance

78.7

37.5

°C/W

Junction-to-top characterization parameter

5.3

6.4

°C/W

Junction-to-board characterization parameter

77.5

37.2

°C/W

Junction-to-case (bottom) thermal resistance

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

Submit Documentation Feedback

Copyright © 2009–2015, Texas Instruments Incorporated

Product Folder Links: LM3445