BCM4354 datasheet(72/192 Pages) CYPRESS

72 / 192 page

PCI Express Interface

BCM4354 Data Sheet

BROADCOM CONFIDENTIAL

Broadcom®

October 15, 2014 • 4354-DS109-R

Page 71

Figure 28 shows the blocks in the HSIC device core.

Key features of HSIC include:

• High-speed 480 Mbps data rate

• Source-synchronous serial interface using 1.2V LVCMOS signal levels

• No power consumed except when a data transfer is in progress

• Maximum trace length of 10 cm.

• No Plug-n-Play support, no hot attach/removal

Figure 28: HSIC Device Block Diagram

PCI Express Interface

The PCI Express (PCIe™) core on the BCM4354 is a high-performance serial I/O interconnect that is protocol

compliant and electrically compatible with the PCI Express Base Specification v3.0 running at Gen1 speeds.

This core contains all the necessary blocks, including logical and electrical functional subblocks to perform PCIe

functionality and maintain high-speed links, using existing PCI system configuration software implementations

without modification.

Organization of the PCIe core is in logical layers: Transaction Layer, Data Link Layer, and Physical Layer, as

shown in Figure 29. A configuration or link management block is provided for enumerating the PCIe

configuration space and supporting generation and reception of System Management Messages by

communicating with PCIe layers.

32-Bit On-Chip Communication System

DMA Engines

RX FIFO

TX FIFOs

Endpoint Management Unit

USB 2.0 Protocol Engine

HSIC PHY

Strobe

Data

BCM4354 Datasheet(PDF) 72 Page - Cypress Semiconductor