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CC2564MODACMOG Datasheet(PDF) 32 Page - Texas Instruments |
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CC2564MODACMOG Datasheet(HTML) 32 Page - Texas Instruments |
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32 / 62 page ![]() CC2564MODN, CC2564MODA SWRS160D – FEBRUARY 2014 – REVISED DECEMBER 2015 www.ti.com 6.2.1.2 RF Interface Guidelines 6.2.1.2.1 RF Trace (CC2564MODN Only) Route the RF traces on layer 1 (top) and keep the routes as short as possible. These traces must be 50- Ω, controlled-impedance traces with reference to the solid ground in the layer 2-microstrip transmission line. The TI reference design uses an RF trace width equal to 17 mils, which conforms to a 50 Ω-±3% simulated result, based on the following PCB properties: (see Table 6-1 and Figure 6-4). • Substrate height: 10 mils • Substrate dielectric: 4.2 • Trace width: 17 mils • Trace thickness: 1.4 mils • Ground clearance: 20 mils TI recommends the following guidelines for a good RF trace design: • The RF traces must have via stitching on both ground planes around the RF trace (see Figure 6-4). • Avoid placing clock signals close to the RF path. • Place a u.FL connector (or similar) between the module and antenna if possible or during prototype phases (see Figure 6-4.) • The RF path should look like one single path along the RF traces and matching components. See Figure 6-5 for the good (OK) case versus the not good (NG) case. • The RF trace bends must be gradual with an approximate maximum bend of 45 degrees with trace mitered. RF traces must not have sharp corners. In addition: – Avoid case (1) in Figure 6-6. A right angle leads to scattering and makes matching weak. – Case (2) in Figure 6-6 is not recommended. Even if this bend had a good 50 Ω, a careful simulation would be required. – Case (3) in Figure 6-6 is recommended. The half-arc angle reduces scattering caused by a right angle. Figure 6-4. Placing a u.FL Connector Between the Module and Antenna 32 Applications, Implementation, and Layout Copyright © 2014–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2564MODN CC2564MODA |
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