LMP7312MASLASHNOPB datasheet(3/29 Pages) TI1

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LMP7312

www.ti.com

SNOSB32B – MARCH 2010 – REVISED MARCH 2013

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2)

ESD Rating (3)

Human Body Model

2000V

Machine Body Model

150V

Charge device Model

1000V

Analog Supply Voltage (VS = V

+ - V-)

DigitaI Supply Voltage (VDIO=VIO-V

Attenuation pins -VIN, +VIN referred to V

±17.5V

Amplification pins -IN, +IN referred to V-

±10V

Voltage at all other pins referred to V-

Storage Temperature Range

-65°C to 150°C

For soldering specification:

http://www.ti.com/lit/SNOA549

Junction Temperature

150°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but for which specific performance is not ensured. For ensured specifications and the test

conditions, see Electrical Characteristics.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(3)

Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22–A115–A (ESD MM std. of

JEDEC). Field-Induced Charge-Device Model, applicable std. JESD22–C101–C (ESD FICDM std. of JEDEC).

Operating Ratings

(1)

Analog Supply Voltage (VS = V

+ – V-), V-=0V

4.5V to 5.5V

Digital Supply Voltage (VDIO = VIO– V

-), V-=0V

2.7V to 5.5V

Attenuation pins -VIN, +VIN referred to V

-15V to 15V

Amplification pins -IN, +IN referred to V-

-2.35V to 7.35V

Temperature Range (2)

−40°C to 125°C

Package Thermal Resistance (2)

SOIC-14

145°C/W

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but for which specific performance is not ensured. For ensured specifications and the test

conditions, see Electrical Characteristics.

(2)

The maximum power dissipation is a function of TJ(max),

θJA. The maximum allowable power dissipation at any ambient temperature

is: PD(max) = (TJ(max) – TA)/

θJA. All numbers apply for packages soldered directly onto a PC Board.

5V Electrical Characteristics

(1)

Unless otherwise specified, all limits ensured for TA = 25°C, V

+ = 5V, V

IO = 5V, V

− = 0V, G = 0.192 V/V, V

CM_ATT=(+VIN+(-

VIN))/2, VCM_AMP=(+IN+(-IN))/2. Differential output configuration. SE = Single Ended Output, DE = Differential Output.Boldface

limits apply at the temperature extremes.

Symbol

Parameter

Conditions

Min (2)

Typ (3)

Max (2)

Units

VOS

Core op-amp Input

Nulling Switch Mode, DE, VOCM = 1V;

–100

100

Offset Voltage

Nulling switch Mode, SE, -VOUT/VR = 1V

–250

250

µV

Nulling Switch Mode, DE, VOCM = 4V;

–100

100

Nulling Switch Mode, SE, -VOUT/VR = 4V

–250

250

(1)

Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very

limited self-heating of the device such that TJ = TA. No ensured specification of parametric performance is indicated in the electrical

tables under conditions of internal self-heating where TJ > TA.

(2)

All limits are specified by testing, design, or statistical analysis.

(3)

Typical values represent the most likely parametric norm at the time of characterization. Actual typical values may vary over time and

will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped production

material.

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